HK

Hiroyuki Kuwae

HI Harima Chemicals, Incorporated: 1 patents #79 of 188Top 45%
WU Waseda University: 1 patents #116 of 411Top 30%
Overall (All Time): #2,589,056 of 4,157,543Top 65%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676935 Bonding method and structure Jun Mizuno, Kosuke Yamada, Masami Aihara, Takayuki Ogawa 2023-06-13