Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9006296 | Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape | Daisuke Itoh, Noriaki Hata, Yorishige Matsuba, Kazuhiro Murata, Hiroshi Yokoyama | 2015-04-14 |
| 7820232 | Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method | Daisuke Itoh, Noriaki Hata, Yorishige Matsuba | 2010-10-26 |