Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157873 | Semiconductor package including bump | Jun-Hyun Cho, Young-Suk Ryu, Il Hwan Cho | 2018-12-18 |
| 7745308 | Method of fabricating micro-vertical structure | Myung Lae Lee, Jong Hyun Lee, Sung Sik Yun, Dae Hun JEONG, Gunn Hwang +2 more | 2010-06-29 |