Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7523914 | High-hardness and corrosion-tolerant integrated circuit packing mold | Yin Yu Chang, Shien Chen Liu | 2009-04-28 |
| 6331332 | Process for depositing diamond-like carbon films by cathodic arc evaporation | — | 2001-12-18 |
| 5319285 | Starting circuit for a high intensity discharge lamp | Brian Dale, James R. McColl | 1994-06-07 |