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Process for improving adhesion of resistive foil to laminating materials |
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2004-11-30 |
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Protective coatings for improved tarnish resistance in metal foils |
Michael A. Centanni |
2004-10-19 |
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Process for manufacturing copper foil on a metal carrier substrate |
Jiangtao Wang, Dan Lillie, David B. Russell |
2004-08-03 |
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Resistor component with multiple layers of resistive material |
Jiangtao Wang, Michael A. Centanni |
2004-08-03 |
| 6622374 |
Resistor component with multiple layers of resistive material |
Jiangtao Wang, Michael A. Centanni |
2003-09-23 |
| 6537675 |
Protective coatings for improved tarnish resistance in metal foils |
Michael A. Centanni |
2003-03-25 |
| 6447929 |
Thin copper on usable carrier and method of forming same |
Jiangtao Wang, Dan Lillie |
2002-09-10 |
| 6183607 |
Anode structure for manufacture of metallic foil |
Jiangtao Wang, John C. Briggs, Michael Stevens |
2001-02-06 |
| 6132887 |
High fatigue ductility electrodeposited copper foil |
Rudolf Wiechmann, Bernd Schneider, Ulrike Bohmler, R. Duane Apperson |
2000-10-17 |
| 6123788 |
Copper wire and process for making copper wire |
Rudolf Wiechmann, Bernd Schneider, Ulrike Bohmler, R. Duane Apperson, Robert J. Fedor +4 more |
2000-09-26 |
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High performance flexible laminate |
Harish D. Merchant |
1999-01-26 |
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Copper wire |
Rudolf Wiechmann, Bernd Schneider, Ulrike Bohmler, R. Duane Apperson, Robert J. Fedor +4 more |
1998-11-03 |
| 5454926 |
Electrodeposited copper foil |
Dino F. DiFranco, Craig J. Hasegawa |
1995-10-03 |
| 5421985 |
Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
Dino F. DiFranco, Craig J. Hasegawa |
1995-06-06 |
| 5403465 |
Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives |
R. Duane Apperson, Richard D. Patrick |
1995-04-04 |
| 5366612 |
Process for making copper foil |
Michael A. Eamon, Thomas L. Jordan, Stephen I. Kohut |
1994-11-22 |
| 5243320 |
Resistive metal layers and method for making same |
Chinho Lee, Mary K. Prokop, Christopher J. Whevell |
1993-09-07 |
| 5215645 |
Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
Dino F. DiFranco |
1993-06-01 |
| 5171417 |
Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same |
Dino F. DiFranco |
1992-12-15 |
| 5017271 |
Method for printed circuit board pattern making using selectively etchable metal layers |
Christopher J. Whewell, Chin-Ho Lee |
1991-05-21 |