Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4898647 | Process and apparatus for electroplating copper foil | Betty L. Berdan | 1990-02-06 |
| 4311768 | Printed circuit board having mutually etchable copper and nickel layers | Betty L. Berdan | 1982-01-19 |
| 4260449 | Method of forming a printed circuit | Betty L. Berdan | 1981-04-07 |
| 4190474 | Method of making a printed circuit board having mutually etchable copper and nickel layers | Betty L. Berdan | 1980-02-26 |