TA

Thomas J. Ameen

GE Gould Electronics: 10 patents #1 of 86Top 2%
GA Ga-Tek: 3 patents #3 of 30Top 10%
GO Gould: 1 patents #131 of 364Top 40%
Overall (All Time): #327,701 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6589413 Method of making a copper on INVAR® composite Chin-Ho Lee, John P. Callahan 2003-07-08
6426146 Treated copper foil and process for making treated copper foil Edward Czapor 2002-07-30
6361673 Electroforming cell Barbara J. Kidon, Peter Peckham 2002-03-26
6224722 Method and apparatus for sequentially metalizing polymeric films and products made thereby Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay 2001-05-01
6132589 Treated copper foil and process for making treated copper foil Edward Czapor 2000-10-17
6086743 Adhesion enhancement for metal foil Stacy A. Riley 2000-07-11
5944965 Method and apparatus for sequentially metalizing polymeric films and products made thereby Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay 1999-08-31
5885436 Adhesion enhancement for metal foil Stacy A. Riley 1999-03-23
5762778 Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath Gregory L. Orloff 1998-06-09
5716502 Method and apparatus for sequentially metalizing polymeric films and products made thereby Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay 1998-02-10
5685970 Method and apparatus for sequentially metalized polymeric films and products made thereby Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay 1997-11-11
5681443 Method for forming printed circuits Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay 1997-10-28
5350487 Method of etching polyimide John A. Payak, Jerome M. Cangelosi 1994-09-27
5322975 Universal carrier supported thin copper line Albert E. Nagy, Peter Peckham 1994-06-21
5228965 Method and apparatus for applying surface treatment to metal foil Adam G. Bay, Robert D. DeWitt 1993-07-20