Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6589413 | Method of making a copper on INVAR® composite | Chin-Ho Lee, John P. Callahan | 2003-07-08 |
| 6426146 | Treated copper foil and process for making treated copper foil | Edward Czapor | 2002-07-30 |
| 6361673 | Electroforming cell | Barbara J. Kidon, Peter Peckham | 2002-03-26 |
| 6224722 | Method and apparatus for sequentially metalizing polymeric films and products made thereby | Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay | 2001-05-01 |
| 6132589 | Treated copper foil and process for making treated copper foil | Edward Czapor | 2000-10-17 |
| 6086743 | Adhesion enhancement for metal foil | Stacy A. Riley | 2000-07-11 |
| 5944965 | Method and apparatus for sequentially metalizing polymeric films and products made thereby | Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay | 1999-08-31 |
| 5885436 | Adhesion enhancement for metal foil | Stacy A. Riley | 1999-03-23 |
| 5762778 | Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath | Gregory L. Orloff | 1998-06-09 |
| 5716502 | Method and apparatus for sequentially metalizing polymeric films and products made thereby | Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay | 1998-02-10 |
| 5685970 | Method and apparatus for sequentially metalized polymeric films and products made thereby | Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay | 1997-11-11 |
| 5681443 | Method for forming printed circuits | Robert D. DeWitt, Peter Peckham, Ronald K. Haines, Adam G. Bay | 1997-10-28 |
| 5350487 | Method of etching polyimide | John A. Payak, Jerome M. Cangelosi | 1994-09-27 |
| 5322975 | Universal carrier supported thin copper line | Albert E. Nagy, Peter Peckham | 1994-06-21 |
| 5228965 | Method and apparatus for applying surface treatment to metal foil | Adam G. Bay, Robert D. DeWitt | 1993-07-20 |