Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10521394 | Apparatus and method for improving application performance within a group of communication devices | Martin R. Pais, Phillip A. Green, Gary J. Cunningham | 2019-12-31 |
| 10254636 | Reducing heat generated during projection of visual content | Daniel M Vacura, Jason Knopsnyder, Martin R. Pais | 2019-04-09 |
| 10025329 | Method and apparatus for adjusting portable electronic device operation based on ambient temperature | Jiri Slaby, Itisha C. Deokar | 2018-07-17 |
| 9698132 | Chip package stack up for heat dissipation | Roger W. Ady, Paul B. Crosbie | 2017-07-04 |
| 9645618 | Skin oscillation convective cooling | Alberto R. Cavallaro, Paul B. Crosbie, Martin R. Pais, Maninder S. Sehmbey | 2017-05-09 |
| 9544861 | Apparatus and method for managing transmitter temperature and power within a group of communication devices | Martin R. Pais, Phillip A. Green, Gary J. Cunningham | 2017-01-10 |
| 9518873 | Electronic system and method for thermal management therein taking into account solar thermal loading | Krishna K. Bellamkonda, Paul B. Crosbie, Brett L. Robertson, Maninder S. Sehmbey | 2016-12-13 |
| 9411385 | Electronic device assembly with compression gasket | Amber M. Pierce, Adam R. Cole, Srikanth V. Thiruppukuzhi | 2016-08-09 |
| 9268376 | Mobile computing device dock station with headset jack heat pipe interface | David A. Winkler, Maninder S. Sehmbey | 2016-02-23 |
| 6237682 | Cooling module including a pressure relief mechanism | Kevin J. McDunn | 2001-05-29 |
| 6234242 | Two-phase thermosyphon including a porous structural material having slots disposed therein | Maninder S. Sehmbey | 2001-05-22 |