Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6043430 | Bottom lead semiconductor chip package | — | 2000-03-28 |
| 5923080 | Semiconductor apparatus having a leadframe with coated leads | — | 1999-07-13 |
| 5849609 | Semiconductor package and a method of manufacturing thereof | — | 1998-12-15 |
| 5731636 | Semiconductor bonding package | — | 1998-03-24 |
| 5644169 | Mold and method for manufacturing a package for a semiconductor chip and the package manufactured thereby | — | 1997-07-01 |
| 5572068 | Integrated double-chip semiconductor package and method for fabricating same | — | 1996-11-05 |
| 5352852 | Charge coupled device package with glass lid | — | 1994-10-04 |
| 5331235 | Multi-chip semiconductor package | — | 1994-07-19 |