Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12328843 | Hybrid heat spreading and heating of a computing system in an autonomous vehicle | Gilberto Madrid Gomez | 2025-06-10 |
| 12041714 | Heat dissipation features of autonomous vehicle sensor | Srinivasa Rao Damaraju, Reza Azizian, Robert Y. Cao, Kaida Chen | 2024-07-16 |
| 12007818 | Floating heat spreader for processing assembly | Robert Y. Cao, Brian Schlotterbeck, Wen-chieh Tang, Roger Lo | 2024-06-11 |
| 11877425 | Heat spreader with integrated fins | Kaida Chen, Srinivasa Rao Damaraju, Cathy Yoon | 2024-01-16 |
| 11778722 | Autonomous vehicle computing device with barrier layer | Reza Azizian, Jameson Tai, Brian Schlotterbeck, Yung-Chang Ko, Srinivasa Rao Damaraju | 2023-10-03 |
| 11737244 | Embedded and immersed heat pipes in automated driving system computers | Yung-Chang Ko | 2023-08-22 |
| 11629920 | Structural mount with integrated cooling for autonomous vehicle sensors | Robert Y. Cao | 2023-04-18 |
| 11324143 | Embedded and immersed heat pipes in automated driving system computers | Yung-Chang Ko | 2022-05-03 |
| 11324144 | Embedded and immersed vapor chambers in automated driving system computers | Yung-Chang Ko | 2022-05-03 |
| 11191190 | Two-phase cooling systems for autonomous driving super computers | Robert Y. Cao | 2021-11-30 |
| 8873237 | Embedded heat pipe in a hybrid cooling system | — | 2014-10-28 |
| 7626815 | Drive bay heat exchanger | — | 2009-12-01 |
| 7551442 | Embedded heat pipe in a hybrid cooling system | — | 2009-06-23 |
| 7542292 | System for efficiently cooling a processor | Jeong-Ha Kim | 2009-06-02 |
| 7428150 | Computing platform component cooling with quick disconnect | — | 2008-09-23 |
| 7382616 | Cooling system for computer hardware | — | 2008-06-03 |
| 7359197 | System for efficiently cooling a processor | Jeong-Ha Kim | 2008-04-15 |
| 7339789 | Modular, scalable thermal solution | Joseph Walters, Tommy Lee | 2008-03-04 |
| 7154749 | System for efficiently cooling a processor | Jeong-Ha Kim | 2006-12-26 |
| 7151667 | Modular, scalable thermal solution | Joseph Walters, Tommy Lee | 2006-12-19 |