Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6588931 | Temperature sensor with flexible circuit substrate | Timothy M. Betzner, David P. O'Connell, Michael J. Boehm | 2003-07-08 |
| 5764130 | Insert molded open air thermal probe with a protective basket | Richard D. Kirkwood | 1998-06-09 |
| 5749656 | Thermal probe assembly with mold-over crimp sensor packaging | Michael J. Boehm, Richard D. Kirkwood | 1998-05-12 |