Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12397680 | Active and passive heat flux control systems for two-phase immersive cooling for high power density electric vehicle components | Jian Yao, Chengwu Duan, Chih-hung Yen, Anil K. Sachdev | 2025-08-26 |
| 12316203 | Axial flux motor assemblies with integrated power electronics and double-sided cooling | Jian Yao, Chengwu Duan | 2025-05-27 |
| 12213291 | Enhanced integration of power inverters using polymer composite encapsulation | Anthony M. Coppola, Erik B. Golm, Alireza Fatemi, Seongchan Pack, Muhammad Hussain Alvi +1 more | 2025-01-28 |
| 12132010 | Metal-coated, polymer-encapsulated electronics modules and methods for making the same | Anthony M. Coppola, Seongchan Pack | 2024-10-29 |
| 11901838 | Inverter module for vehicle | Muhammad Hussain Alvi, Chandra S. Namuduri | 2024-02-13 |
| 11876034 | 3-D power modules with double sided cooling per semiconductor die | Muhammad Hussain Alvi, Rashmi Prasad, Anthony M. Coppola | 2024-01-16 |
| 11817750 | Planar power module with high power density packaging | Anthony M. Coppola, Muhammad Hussain Alvi | 2023-11-14 |
| 11608547 | Enhanced aluminum alloy galvanically compatible with magnesium alloy components | Wenying Yang, Qigui Wang | 2023-03-21 |
| 11548317 | Brake rotor and lightweight wheel assembly | Henry ZHAN, Jianfeng Wang, Congjie Wang, Anil K. Sachdev | 2023-01-10 |
| 11375642 | Electronic power module assemblies and control logic with direct-cooling vapor chamber systems | Anthony M. Coppola, Kestutis A. Sonta | 2022-06-28 |
| 11207982 | Electronic power module assemblies and control logic with direct-cooling heat pipe systems | Anthony M. Coppola, Kestutis A. Sonta | 2021-12-28 |
| 10711330 | Corrosion-resistant magnesium-aluminum alloys including germanium | Yang Guo, Anil K. Sachdev | 2020-07-14 |
| 9797036 | Method of making corrosion resistant and glossy appearance coating for light metal workpiece | Lei Gao | 2017-10-24 |
| 6963140 | Transistor having multiple gate pads | Johnny Kin On Sin, Tommy Lai | 2005-11-08 |
| 5923998 | Enlarged align tolerance in buried contact process using sidewall spacer | — | 1999-07-13 |
| 5843835 | Damage free gate dielectric process during gate electrode plasma etching | — | 1998-12-01 |
| 5844284 | Damage free buried contact using salicide technology | — | 1998-12-01 |
| 5804455 | Reduced primary crystalline defect damage in NMOSFETS with an optimized LDD structure | — | 1998-09-08 |
| 5759919 | Method for reducing gate oxide damages during gate electrode plasma etching | — | 1998-06-02 |
| 5705418 | Process for fabricating reduced-thickness high-resistance load resistors in four-transistor SRAM devices | — | 1998-01-06 |
| 5686338 | Process for fabricating high-resistance load resistors using dummy polysilicon in four-transistor SRAM devices | — | 1997-11-11 |
| 5679607 | Method of manufacturing a damage free buried contact using salicide technology | — | 1997-10-21 |
| 5567270 | Process of forming contacts and vias having tapered sidewall | — | 1996-10-22 |