Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8967453 | Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components | Khiet Le, VICENTIU GROSU, Gregory S. Smith, Yunqi Zheng | 2015-03-03 |
| 8847427 | Prediction of transistor temperature in an inverter power module of a vehicle, and related operating methods | Khiet Le, David Tang, Seok-Joo Jang, Song He | 2014-09-30 |