| 9917065 |
Power module assembly with reduced inductance |
Terence G. Ward, Constantin C. Stancu, Marko Jaksic |
2018-03-13 |
| 8488315 |
Power module assemblies with staggered coolant channels |
Nicholas Hayden Herron, Mark D. Korich |
2013-07-16 |
| 8279620 |
Low inductance power electronics assembly |
Nicholas Hayden Herron, Mark D. Korich, CINDY CHOU, David Tang, Douglas S. Carlson +1 more |
2012-10-02 |
| 8248809 |
Inverter power module with distributed support for direct substrate cooling |
David H. Miller, Mark D. Korich, Terence G. Ward |
2012-08-21 |
| 8169779 |
Power electronics substrate for direct substrate cooling |
Khiet Le, Terence G. Ward, Edward P. Yankoski, Gregory S. Smith |
2012-05-01 |
| 7948125 |
System and method for cooling an electric motor |
George R. Woody, Terence G. Ward |
2011-05-24 |
| 7884468 |
Cooling systems for power semiconductor devices |
George R. Woody, Terence G. Ward, David F. Nelson |
2011-02-08 |
| 7847256 |
Secure enclosure |
Seok-Joo Jang, Terrence G. Ward, Daniel Kaplan, Louis Thompson |
2010-12-07 |
