Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9111999 | Technique for reducing plasma-induced etch damage during the formation of vias in interlayer dielectrics by modified RF power ramp-up | Matthias Zinke | 2015-08-18 |
| 9018102 | Technique for reducing plasma-induced etch damage during the formation of vias in interlayer dielectrics by modified RF power ramp-up | Matthias Zinke | 2015-04-28 |
| 8492279 | Method of controlling critical dimensions of vias in a metallization system of a semiconductor device during silicon-ARC etch | Johann Steinmetz | 2013-07-23 |