Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9272899 | Bonding method using porosified surfaces for making stacked structures | Rama Krishna Kotlanka, Rakesh Kumar, Huamao Lin, Pradeep Ramachandramurthy Yelehanka | 2016-03-01 |
| 8940616 | Bonding method using porosified surfaces for making stacked structures | Rama Krishna Kotlanka, Rakesh Kumar, Huamao Lin, Pradeep Ramachandramurthy Yelehanka | 2015-01-27 |
| 8513767 | Package interconnects | Rama Krishna Kotlanka, Rakesh Kumar, Pradeep Ramachandramurthy Yelehanka | 2013-08-20 |