SL

Sheng-Wei Lin

GU Global Unichip: 5 patents #30 of 210Top 15%
TSMC: 5 patents #4,208 of 12,232Top 35%
AM Amazon: 4 patents #4,009 of 19,158Top 25%
AM Apex Medical: 3 patents #10 of 74Top 15%
RS Realtek Semiconductor: 2 patents #608 of 1,741Top 35%
EC Eternal Materials Co.: 2 patents #12 of 90Top 15%
MP Mpi: 1 patents #100 of 183Top 55%
SA Shl Medical Ag: 1 patents #90 of 131Top 70%
AE Advanced Semiconductor Engineering: 1 patents #625 of 1,073Top 60%
TE Tencent: 1 patents #4,257 of 8,131Top 55%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
CS Cadence Design Systems: 1 patents #1,216 of 2,263Top 55%
TI Texas Instruments: 1 patents #7,357 of 12,488Top 60%
CA Chroma Ate: 1 patents #88 of 219Top 45%
DE Delta Electronics: 1 patents #1,366 of 2,746Top 50%
📍 New Taipei, NC: #1 of 5 inventorsTop 20%
Overall (All Time): #141,209 of 4,157,543Top 4%
27
Patents All Time

Issued Patents All Time

Showing 26–27 of 27 patents

Patent #TitleCo-InventorsDate
8618664 Semiconductor package and method for packaging the same 2013-12-31
7219679 Dual-purpose cane Meng-Hui Hsu, Hsueh-Yu Chen, Bing-Hung Lin, Cheng-De Hong, Danver Wang 2007-05-22