CL

Chin-Sung Lin

GU Global Unichip: 2 patents #71 of 210Top 35%
PA Philips Electronics North America: 2 patents #192 of 725Top 30%
TSMC: 2 patents #6,667 of 12,232Top 55%
AL Ali: 1 patents #43 of 149Top 30%
TA Tera Autotech: 1 patents #7 of 11Top 65%
📍 New Taipei, NY: #37 of 56 inventorsTop 70%
Overall (All Time): #819,427 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
11482475 Ground wing portion for electronic package device 2022-10-25
9449909 Method of forming a package substrate Li-Hua Lin, Yu-Yu Lin 2016-09-20
8289727 Package substrate Li-Hua Lin, Yu-Yu Lin 2012-10-16
7410273 LED lamp assembly 2008-08-12
6298387 System for detecting a data packet in a bitstream by storing data from the bitstream in a buffer and comparing data at different locations in the buffer to predetermined data Sanand Prasad, Samuel O. Akiwumi-Assani 2001-10-02
6154468 Fast sync-byte search scheme for packet framing Samuel O. Akiwumi-Assani, Sanand Prasad 2000-11-28