Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11978711 | Solder ball application for singular die | — | 2024-05-07 |
| 11508680 | Solder ball application for singular die | — | 2022-11-22 |
| 11077654 | Conductive diamond application system | — | 2021-08-03 |
| 10654259 | Conductive diamond application method | — | 2020-05-19 |
| 10460326 | Counterfeit integrated circuit detection by comparing integrated circuit signature to reference signature | — | 2019-10-29 |
| 10431510 | Hermetic lid seal printing method | — | 2019-10-01 |
| 10177056 | Repackaged integrated circuit assembly method | Timothy Mark Barry | 2019-01-08 |
| 10177054 | Method for remapping a packaged extracted die | — | 2019-01-08 |
| 10147660 | Remapped packaged extracted die with 3D printed bond connections | — | 2018-12-04 |
| 10128161 | 3D printed hermetic package assembly and method | — | 2018-11-13 |
| 10115645 | Repackaged reconditioned die method and assembly | — | 2018-10-30 |
| 10109606 | Remapped packaged extracted die | — | 2018-10-23 |
| 10002846 | Method for remapping a packaged extracted die with 3D printed bond connections | — | 2018-06-19 |
| 9966319 | Environmental hardening integrated circuit method and apparatus | — | 2018-05-08 |
| 9935028 | Method and apparatus for printing integrated circuit bond connections | — | 2018-04-03 |
| 9870968 | Repackaged integrated circuit and assembly method | Timothy Mark Barry | 2018-01-16 |
| 9824948 | Integrated circuit with printed bond connections | — | 2017-11-21 |
| 9711480 | Environmental hardened packaged integrated circuit | — | 2017-07-18 |
| 8466371 | Printed circuit board interconnecting structure with compliant cantilever interposers | — | 2013-06-18 |