BW

Ben Weng

GL Global Advanced Packaging Technology H.K. Limited: 1 patents #3 of 6Top 50%
Overall (All Time): #3,456,670 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6933592 Substrate structure capable of reducing package singular stress Virgil Liao, Jai Yi Wang 2005-08-23