DL

Da Yeon Lee

GC Gigalane Co.: 10 patents #16 of 39Top 45%
AC Ajou University Industry-Academic Cooperation: 1 patents #220 of 591Top 40%
AM Amorepacific: 1 patents #384 of 696Top 60%
Overall (All Time): #409,163 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11489241 Transmission line having improved bending durability Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee Seok Jung 2022-11-01
11261475 Nano-neurotoxicity bio-marker composition based on intracellular aggregates which are biomarkers of degenerative brain diseases Tae Hwan Shin, Geetika Phukan, Man Jeong Paik, Hyeon Seong Lee, Hyung-Jin Park +1 more 2022-03-01
10912809 Enhancer for catechin uptake in enterocytes Su-Kyung Kim, Jin Oh Chung, Wan Gi Kim, Jeong-Kee Kim, Song Seok Shin +3 more 2021-02-09
10750612 Flexible circuit board having enhanced bending durability and method for preparing same Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung 2020-08-18
10624209 Flexible printed circuit board Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Hwang Sub Koo +2 more 2020-04-14
10561015 Flexible circuit board having enhanced bending durability and method for preparing same Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung 2020-02-11
10477690 Flexible circuit board Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim +1 more 2019-11-12
10448499 Flexible printed circuit board with narrower line width Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee Seok Jung 2019-10-15
10365687 Laptop computer Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Hwang Sub Koo +2 more 2019-07-30
10362675 Flexible circuit board having three-layer dielectric body and four-layer ground layer structure Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung 2019-07-23
10356895 Flexible circuit board having enhanced bending durability and method for preparing same Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung 2019-07-16
10299375 Flexible circuit board having enhanced bending durability Sang Pil Kim, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung 2019-05-21