Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9480960 | Process for preparing phase change microcapsule having thermally conductive shell | Yi-Hsiuan Yu, Yen-Lin Tseng, HOU-AN HSIEH | 2016-11-01 |
| 8980120 | Heat dissipating material and method for preparing the same | Tien-Chieh Wu | 2015-03-17 |