Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910523 | Light emitting device | Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo +1 more | 2021-02-02 |
| D886751 | Light emitting diode module | Xun-Xain Zhan, Yu-Feng Lin | 2020-06-09 |
| D854195 | Light emitting diode package | Xun-Xain Zhan, Yu-Feng Lin | 2019-07-16 |
| 10147709 | Light emitting module | Yu-Feng Lin | 2018-12-04 |
| 10090445 | Package method and package | Chin-Hua Hung, Yu-Feng Lin | 2018-10-02 |
| 10064272 | Light emitting device using metal substrate for improving heat dissipation efficiency | Yu-Feng Lin, Meng-Ting Tsai | 2018-08-28 |
| 9997676 | Light emitting device and manufacturing method thereof | Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo +1 more | 2018-06-12 |
| 9953956 | Package substrate and package structure using the same | Yu-Feng Lin, Xun-Xain Zhan | 2018-04-24 |
| 9801274 | Light emitting device | Yu-Feng Lin, Meng-Ting Tsai | 2017-10-24 |
| D796456 | Light emitting diode package | Yu-Feng Lin, Xun-Xain Zhan | 2017-09-05 |
| D790487 | Light emitting diode package substrate | Yu-Feng Lin, Xun-Xain Zhan | 2017-06-27 |
| 9685596 | Package method and package | Chin-Hua Hung, Yu-Feng Lin | 2017-06-20 |
| D772181 | Light emitting diode package substrate | Yu-Feng Lin, Xun-Xain Zhan | 2016-11-22 |
| D762596 | Light emitting diode package substrate | Yu-Feng Lin, Xun-Xain Zhan | 2016-08-02 |
| D761214 | Light emitting diode package | Yu-Feng Lin, Xun-Xain Zhan | 2016-07-12 |
| D761213 | Light emitting diode module | Yu-Feng Lin, Xun-Xain Zhan | 2016-07-12 |
| 9027399 | Liquid level sensor | TIAN-FENG HUANG, WEN-LI WANG | 2015-05-12 |
| 8882974 | Support mechanism | TIAN-FENG HUANG, Bo-Chang Li, WEN-LI WANG | 2014-11-11 |