Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8268504 | Thermomechanical sealing of interconnect manifolds in fuel cell stacks | Shu Ching Quek, Andrew Philip Shapiro, Chandra Sekher Yerramalli | 2012-09-18 | $20,205,000 |