MR

Malgorzata Iwona Rubinsztajn

GE: 12 patents #2,707 of 36,430Top 8%
📍 Ballston Spa, NY: #34 of 212 inventorsTop 20%
🗺 New York: #12,360 of 115,490 inventorsTop 15%
Overall (All Time): #416,615 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
9956520 Liquid carbon dioxide absorbents, methods of using the same, and related systems Robert James Perry, Grigorii Lev Soloveichik, Michael Joseph O'Brien, Larry Neil Lewis, Tunchiao Hubert Lam +2 more 2018-05-01
9440182 Liquid carbon dioxide absorbents, methods of using the same, and related systems Michael Joseph O'Brien, Robert James Perry, Tunchiao Hubert Lam, Grigorii Lev Soloveichik, Sergei Kniajanski +2 more 2016-09-13
8435673 Cathode composition with phosphorus composition additive and electrochemical cell comprising same John Patrick Lemmon, Jun Cui, Richard Louis Hart, Jennifer Kathleen Redline 2013-05-07
8030509 Carbon dioxide absorbent and method of using the same Robert James Perry, Larry Neil Lewis, Michael Joseph O'Brien, Grigorii Lev Soloveichik, Sergei Kniajanski +2 more 2011-10-04
7144763 Epoxy resin compositions, solid state devices encapsulated therewith and method Slawomir Rubinsztajn 2006-12-05
6916889 Epoxy resin compositions, solid state devices encapsulated therewith and method Slawomir Rubinsztajn 2005-07-12
6878783 Solid state device with encapsulant of cycloaliphatic epoxy resin, anhydride, and boron catalyst Gary William Yeager 2005-04-12
6809162 Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst 2004-10-26
6632892 Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst Slawomir Rubinsztajn 2003-10-14
6617400 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst Gary William Yeager 2003-09-09
6617401 Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst 2003-09-09
6507049 Encapsulants for solid state devices Gary William Yeager 2003-01-14