Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7969868 | Path-level protection for digitally wrapped payloads | Christopher C. Liou, Rajasekar Venkatesan, Biao Lu | 2011-06-28 |
| 5721177 | Nonwoven moldable composite | — | 1998-02-24 |
| 5492580 | Nonwoven moldable composite and method of manufacture | — | 1996-02-20 |
| 5093967 | Attachment mechanism for nonwoven thermoformed articles and method of manufacture thereof | — | 1992-03-10 |