Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166115 | Solder resist structure for embedded die packaging of power semiconductor devices | Ahmad Mizan, Maryam Abouie | 2024-12-10 |
| 11776883 | Embedded die packaging for power semiconductor devices | Greg P. Klowak | 2023-10-03 |
| 11476188 | Fabrication of embedded die packaging comprising laser drilled vias | — | 2022-10-18 |
| 11342248 | Embedded die packaging for power semiconductor devices | Greg P. Klowak | 2022-05-24 |
| 9824949 | Packaging solutions for devices and systems comprising lateral GaN power transistors | Greg P. Klowak, Ahmad Mizan, Stephen S. Coates | 2017-11-21 |
| 9818857 | Fault tolerant design for large area nitride semiconductor devices | Greg P. Klowak, Howard Tweddle, Ahmad Mizan, Nigel Springett | 2017-11-14 |
| 9818692 | GaN semiconductor device structure and method of fabrication by substrate replacement | John Roberts, Greg P. Klowak | 2017-11-14 |
| 9589869 | Packaging solutions for devices and systems comprising lateral GaN power transistors | Greg P. Klowak, Ahmad Mizan | 2017-03-07 |
| 9589868 | Packaging solutions for devices and systems comprising lateral GaN power transistors | Greg P. Klowak, Ahmad Mizan | 2017-03-07 |
| 9153509 | Fault tolerant design for large area nitride semiconductor devices | Gregory P. Klowak, Howard Tweddle, Ahmad Mizan, Nigel Springett | 2015-10-06 |