Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784158 | Producing apparatus | Liang-Yin Huang, Ee-Sun Lim | 2023-10-10 |
| 10643968 | Vertically die-stacked bonder and method using the same | Liang-Yin Huang | 2020-05-05 |
| 10438917 | Vertically die-stacked bonder and method using the same | Liang-Yin Huang | 2019-10-08 |
| 6132161 | Chip supplying apparatus performing stable blue-film-expansion operation | Wen-Jung Lu, Wen-Chin Cheng, Ming-Liang Hsieh | 2000-10-17 |