Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374646 | Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body | Hidemichi Fujiwara, Yoshihiro Sato | 2025-07-29 |
| 11466181 | Metal particle-containing composition and electrically conductive adhesive film | Tomohiro Ishii, Hidemichi Fujiwara | 2022-10-11 |