Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339269 | High frequency IC package, high frequency unit using high frequency IC package, and manufacturing method thereof | Masayoshi Shouno, Tomohiko Tamaki | 2008-03-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339269 | High frequency IC package, high frequency unit using high frequency IC package, and manufacturing method thereof | Masayoshi Shouno, Tomohiko Tamaki | 2008-03-04 |