Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5475236 | Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process | — | 1995-12-12 |
| 5057904 | Socket unit for package having pins and pads | Mitsuki Nagato | 1991-10-15 |