Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8128768 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2012-03-06 |
| 7819165 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2010-10-26 |
| 7703494 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2010-04-27 |
| 7681522 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2010-03-23 |
| 7621310 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2009-11-24 |
| 7513966 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2009-04-07 |
| 7354494 | Apparatus and method for manufacturing laminated substrate | Yoshimasa Miyajima, Ariyoshi Shibata, Joji Hasegawa | 2008-04-08 |
| 7300532 | Method for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2007-11-27 |
| 7096911 | Apparatus for manufacturing bonded substrate | Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano | 2006-08-29 |
| 6382900 | Apparatus for conveyance of semiconductor chips | Chihiro Makara | 2002-05-07 |