Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5984165 | Method of bonding a chip part to a substrate using solder bumps | Katsuhiro Inoue, Nobuo Igusa | 1999-11-16 |
TO
Takeshi OHORI
Overall (All Time): #3,667,375 of 4,157,543Top 90%
1
Patents All Time