Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5994771 | Semiconductor package with multilayer circuit, and semiconductor device | Masayuki Sasaki | 1999-11-30 |
| 4372804 | Method for making multilayer printed wiring board | Kenji Yamamoto, Shinzi Umemoto, Keiji Kurosawa, Mitsuo Yamashita | 1983-02-08 |