Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6255138 | Process for producing microencapsulated electroconductive filler | — | 2001-07-03 |
TH
Takahiro Haishima
Threebond Co.: 1 patents #61 of 172Top 40%
Overall (All Time): #3,586,843 of 4,157,543Top 90%
1
Patents All Time