Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6222738 | Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof | Yoshinobu Maeno, Kenichiro Abe | 2001-04-24 |