Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10299387 | Substrate on which electronic component is soldered, electronic device, method for soldering electronic component | Yoshikazu Hirano, Toru Okada | 2019-05-21 |
| 7835159 | Method of making assembly module and board module and electronic apparatus | Yutaka Higashiguchi, Masahiko Yamashita | 2010-11-16 |
| 7321099 | Component mounting substrate and structure | — | 2008-01-22 |
| 5799392 | Method of manufacturing a connecting structure of printed wiring boards | — | 1998-09-01 |