Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8925188 | Component mounting apparatus | Toru Nishino | 2015-01-06 |
| 8769810 | Part mounting method | Toru Nishino | 2014-07-08 |
| 8431052 | Manufacturing apparatus and method for optical waveguide structure | — | 2013-04-30 |
| 8065793 | Method of encapsulating an electronic component | Junzou Une, Jun Matsueda | 2011-11-29 |
| 7938160 | Ultrasonic bonding apparatus | Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Taizan Kobayashi, Toshinori Kasuga | 2011-05-10 |
| 7905268 | Ultrasonic bonding apparatus | Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Taizan Kobayashi, Toshinori Kasuga | 2011-03-15 |
| 7823618 | Ultrasonic bonding apparatus | Yasuyuki Masuda, Yukio Ozaki, Jun Matsueda, Taizan Kobayashi, Toshinori Kasuga | 2010-11-02 |
| 7790499 | Observation apparatus and method for observing void in underfill resin | Masahiko Sato, Toru Nishino | 2010-09-07 |
| 7513032 | Method of mounting an electronic part to a substrate | Koichi Shimamura | 2009-04-07 |