Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8975092 | Method and system for controlling chip warpage during bonding | Michael G. Lee | 2015-03-10 |
| 8859335 | Method and system for controlling chip inclination during flip-chip mounting | Michael G. Lee | 2014-10-14 |
| 8633592 | Hybrid interconnect technology | Michael G. Lee | 2014-01-21 |
| 7341936 | Semiconductor device and method of manufacturing the same | Takahiro Kimura | 2008-03-11 |
| 6841477 | Metal interconnection, semiconductor device, method for forming metal interconnection and method for fabricating semiconductor device | — | 2005-01-11 |
| 5982036 | Multi-layered structure for ohmic electrode fabrication | Masanori Murakami, Akira Otsuki, Takeo Oku, Masaru Wada | 1999-11-09 |
| 5904554 | Method for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrode | Masanori Murakami, Akira Otsuki, Takeo Oku, Masaru Wada | 1999-05-18 |
| 5767007 | Method for fabricating ohmic electrode and multi-layered structure for ohmic fabricating electrode | Masanori Murakami, Akira Otsuki, Takeo Oku, Masaru Wada | 1998-06-16 |