Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121114 | Wire bonding tool including a wedge tool | Takanori Sugiyama | 2021-09-14 |
| 9595491 | Apparatus for manufacturing semiconductor device and the semiconductor device | Kazunaga Onishi | 2017-03-14 |