Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177236 | Semiconductor device having case to which circuit board is bonded by bonding material and method of manafacturing thereof | — | 2021-11-16 |
| 10381243 | Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case | — | 2019-08-13 |
| 9832903 | Power semiconductor module device | — | 2017-11-28 |
| 8994164 | Semiconductor device and semiconductor device manufacturing method | Hideaki Takahashi, Yo Sakamoto | 2015-03-31 |
| D724554 | Semiconductor module | Satoru Motohashi, Hideaki Takahashi, Kenshi Terashima | 2015-03-17 |