Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7030469 | Method of forming a semiconductor package and structure thereof | Michael Chapman, Arvind S. Salian | 2006-04-18 |
| 7012324 | Lead frame with flag support structure | Gary Li, Michael Chapman | 2006-03-14 |
| 6401545 | Micro electro-mechanical system sensor with selective encapsulation and method therefor | David J. Monk, Song Woon Kim, Kyujin Jung, Bishnu Prasanna Gogoi, Gordon Bitko +2 more | 2002-06-11 |
| 5686698 | Package for electrical components having a molded structure with a port extending into the molded structure | D. Lawrence Boughter | 1997-11-11 |