Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319660 | Semiconductor device packages using a thermally enhanced conductive molding compound | — | 2019-06-11 |
| 9484320 | Vertically packaged integrated circuit | — | 2016-11-01 |
| 6300234 | Process for forming an electrical device | Todd M. Flynn, Larry J. Larsen | 2001-10-09 |