Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133264 | Electronic system comprising a lower redistribution layer and method for manufacturing such an electronic system | — | 2021-09-28 |
| 10438923 | Method for integrating at least one 3D interconnection for the manufacture of an integrated circuit | — | 2019-10-08 |
| 8669638 | High power semiconductor device for wireless applications and method of forming a high power semiconductor device | Jean Marie Boulay | 2014-03-11 |