Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334357 | Method of forming material layer | Kyung-Eun BYUN, Sangwoo Kim, Minsu SEOL, Hyeonjin Shin, Minseok SHIN +2 more | 2025-06-17 |
| 7929309 | Heat sink assembly having clip | Dong Zheng, Meng Fu, Chun-Chi Chen | 2011-04-19 |
| 7760509 | Heat dissipation device having fastening structure | Dong Zheng, Meng Fu, Chun-Chi Chen | 2010-07-20 |