Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10124405 | Manufacturing method for metallic housing of electronic device | CAI-HUA WANG, YUE-JIAN LI, Wen-Hsiung Chang, Chun-Jung Chang | 2018-11-13 |
| 10040120 | Manufacturing method for metallic housing of electronic device | CAI-HUA WANG, YUE-JIAN LI, Wen-Hsiung Chang, Chun-Jung Chang | 2018-08-07 |
| 9901979 | Metallic article and method for manufacturing metallic article | Jun Yang, CAI-HUA WANG, YUE-JIAN LI, Wen-Hsiung Chang, Chun-Jung Chang | 2018-02-27 |
| 9370823 | Metallic housing of electronic device and manufacturing method thereof | CAI-HUA WANG, YUE-JIAN LI, Wen-Hsiung Chang, Chun-Jung Chang | 2016-06-21 |
| 9358606 | Metallic housing of electronic device and manufacturing method thereof | CAI-HUA WANG, YUE-JIAN LI, Wen-Hsiung Chang, Chun-Jung Chang | 2016-06-07 |
| 7740050 | Mold for manufacturing heat dissipation apparatus | NIEN-TIEN CHENG, Zhi Liu | 2010-06-22 |
| 7537049 | Heat dissipation apparatus | NIEN-TIEN CHENG | 2009-05-26 |
| 7460370 | Heat dissipation assembly | NIEN-TIEN CHENG | 2008-12-02 |