Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413909 | Package structure of micro speaker | Yu-Xuan XU | 2025-09-09 |
| 12294845 | Package structure of micro speaker | Yu-Xuan XU, Li-Jen Chen, Yu-Ting Cheng | 2025-05-06 |
| 12170877 | Package structure of micro speaker and method for forming the same | Yu-Xuan XU | 2024-12-17 |
| 11995246 | Method for touchless gesture recognition, and apparatuses using the same | Yu-Xuan XU, Ching-Lung Chan, Shih-Chung Wang, Yen-Son Paul Huang | 2024-05-28 |
| 11818563 | Package structure of micro speaker and method for forming the same | Li-Jen Chen, Yu-Xuan XU, Yu-Ting Cheng | 2023-11-14 |
| 11665484 | Package structure of micro speaker | Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng | 2023-05-30 |
| 11051106 | Movable embedded microstructure | Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng | 2021-06-29 |
| 9439309 | Electronic apparatus and controlling method thereof | Chun-Te Shen, Yung-Ming Tien, Chih-Tarng Chuang, Hong-Tien Wang, Shi-Kuan Chen +2 more | 2016-09-06 |
| 9137913 | Portable electronic device and cradle | Wei-Chih Hsu, Shi-Kuan Chen, Hong-Tien Wang, Yung-Hsiang Chen, Yung-Ming Tien +5 more | 2015-09-15 |
| 8351635 | Silicon-based microphone structure with electromagnetic interference shielding means | Chih-Hao Sun | 2013-01-08 |
| 8102015 | Microphone package with minimum footprint size and thickness | Wei-Chan Hsu | 2012-01-24 |
| 6967145 | Method of maintaining photolithographic precision alignment after wafer bonding process | Chung-Yang Tseng, Reuy-shing Huang, Tong-An Lee, Kuo-Chung Chan, Hung-Dar Wang | 2005-11-22 |
| 6864176 | Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement method | Hung-Dar Wang, Ruey-Shing Huang, Chung-Yang Tseng | 2005-03-08 |
| 6838303 | Silicon pressure sensor and the manufacturing method thereof | Hung-Dar Wang | 2005-01-04 |