Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11626357 | 3D electrical integration using component carrier edge connections to a 2D contact array | Roy J. Henson | 2023-04-11 | $25,573,000 |
| 10602833 | Convertible briefcase and garment case with adjustable saddlebag attachment | — | 2020-03-31 | |
| 9869697 | Wiring substrate with filled vias to accommodate custom terminals | — | 2018-01-16 | $12,092,000 |
| 9523715 | Wiring substrate with filled vias to accommodate custom terminals | — | 2016-12-20 | $7,977,000 |
| 7622935 | Probe card assembly with a mechanically decoupled wiring substrate | Eric D. Hobbs, Alexander H. Slocum, Benjamin N. Eldridge, Keith J. Breinlinger | 2009-11-24 | $4,128,000 |