YP

Yi-Hsi Pao

Ford: 2 patents #6,445 of 17,473Top 40%
📍 Livonia, MI: #623 of 1,586 inventorsTop 40%
🗺 Michigan: #35,034 of 86,293 inventorsTop 45%
Overall (All Time): #2,222,983 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6187601 Plastic encapsulated IC package and method of designing same Jun HU 2001-02-13
5773877 Plastic encapsulated IC package and method of designing same Jun HU 1998-06-30