Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5872700 | Multi-chip module package with insulating tape having electrical leads and solder bumps | — | 1999-02-16 |
| 4766922 | Procedure for forming cocks closable by freezing, belonging to a liquid batch handling unit, and handling unit set up according to the procedure | Niilo Kaartinen, Henrik Johansson, Ahti Leinvuo | 1988-08-30 |